发明名称 |
Adhesive composition and adhesive dry film |
摘要 |
<p>An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1):
wherein R 1 to R 4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0 < (c+d)/(a+b+c+d) ‰¤ 1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.</p> |
申请公布号 |
EP2492332(A1) |
申请公布日期 |
2012.08.29 |
申请号 |
EP20120156466 |
申请日期 |
2012.02.22 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TAKEDA, TAKANOBU;SOGA, KYOKO;ASAI, SATOSHI |
分类号 |
C09J183/06;C08G77/14;C08G77/50;C08G77/52;C09J183/14;C09J183/16 |
主分类号 |
C09J183/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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