| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a flexible printed wiring board, including no halogen with consideration given to an environment, having excellent flame retardancy and insulation reliability, and forming a cover insulation layer which hardly causes deposition of a flame retardant component. <P>SOLUTION: The photosensitive resin composition includes: a linear polymer (A) containing a structural unit represented by the residue of a compound, wherein a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is added to a (meth)acryloyl group in an allyl (meth)acrylate, and a carboxyl group; an ethylenically unsaturated group-containing polymerizable compound (B); a photopolymerization initiator (C); and a thermosetting compound (D). <P>COPYRIGHT: (C)2010,JPO&INPIT |
