发明名称 METAL LAYER STRUCTURE OF MULTILAYER FLEXIBLE BORAD AND MAKING METHOD THEREOF
摘要 <p>Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved.</p>
申请公布号 EP2493274(A1) 申请公布日期 2012.08.29
申请号 EP20100824385 申请日期 2010.01.25
申请人 PRINCO CORP. 发明人 YANG, CHIH-KUANG
分类号 H05K3/40;H05K1/11;H05K3/04;H05K3/38 主分类号 H05K3/40
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