| 摘要 |
<p>The invention relates to a method for producing a number of vias (6) in order to create electrically and/or thermally conductive connections between different faces (3, 4) of a substrate (1). The invention further relates to a substrate (1) comprising at least one via (6) that is produced in such a manner. The aim of the invention is to produce vias (6) in a particularly easy manner. This is achieved in that at least one electrically and/or thermally conductive foil (7) is inserted into a through-opening (8, 16) that connects different substrate faces (3, 4), and areas (9) of the at least one foil (7) are fixed near the edges (11) of the opening (8, 16) on the surfaces of the substrate faces (3, 4).</p> |
