| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure the nonconductivity between wiring conductors while suppressing upsizing of a device, and also to reduce a wiring inductance of connection of a laminated wiring conductor. <P>SOLUTION: Plate conductors 101 and 102 are provided with bends 101a and 102a, respectively, which are constituted by bending the ends of the plate conductors 101 and 102 vertically, and also plate conductors 103 and 104 are provided with bends 103a and 104a, respectively, which are constituted by bending the ends of the plate conductors 103 and 104 vertically. A groove 51 is formed in insulating material in the connection between the laminated wiring conductors 11 and 12. The planes of the bends 101a and 103a are abutted against each other to thereby connect the plate conductors 101 and 103, and also the planes of the bends 102a and 104a are abutted against each other to thereby connect the plate conductors 102 and 104. <P>COPYRIGHT: (C)2009,JPO&INPIT |
