| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing a lead frame assembly which can improve adhesive strength between connecting members of different metals connecting a plurality of electrodes and leads of electronic components mounted inside the semiconductor device, and the leads. <P>SOLUTION: A first plated layer 20a is formed on a surface of an inner end part 4a of a first lead 4, a first plated layer 20a and a second plated layer 20b formed on a surface of the first plated layer 20a are formed on a surface of an inner end part 5a of a second lead 5. The inner end part 4a of the first lead 4 and a first electronic component 2 are electrically connected by a first connecting member 6, and the inner end part 5a of the second lead 5 and a second electronic component 3 are electrically connected by a second connecting member 7. Furthermore, the deterioration of adhesive strength by metal migration can be prevented by arranging the inner end part 4a of the first lead 4 separately from a supporting plate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
