| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve the compatification of a resin sealing apparatus having a plurality of compression molding dies and the improvement of the sealing productivity. <P>SOLUTION: The resin sealing apparatus 100 for sealing the substrate mounted with semiconductor chips with a resin is provided, which has the substrate stocking part 104 wherefrom the unsealed substrate is supplied and holds the sealed substrate, the plurality of compression molding dies 110 arranged in a row, the X-direction guides 106 arranged parallel to the arrangement direction of the compression molding dies 110, and the substrate transferring mechanism 112 that is movable on the X-direction guides 106 and conducts both the carrying-in of the pre-sealing substrate to the compression molding dies 110 and the carrying-out of the post-sealing substrate from the compression molding dies 110, in which the substrate stocking part 104 is arranged in the same side with the compression molding dies 110. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
