| 摘要 |
A method includes a stacked substrate forming step (S1) of bonding a piezoelectric substrate (3) onto a first base substrate (2), a groove forming step (S2) of alternately forming ejection grooves (5) and a dummy grooves (6) in parallel with one another, the ejection grooves and the dummy grooves having a depth to pierce the piezoelectric substrate and to reach the first base substrate, an electrode material depositing step (S3) of depositing a electrode material (8) on inner surfaces of the ejection grooves and a dummy grooves (6), a cover plate bonding step (S4) of bonding a cover plate (9), a first base substrate removing step (S5) of removing a part of the first base substrate and removing the electrode material, and a second base substrate bonding step (S6) of bonding a second base substrate (10) to the first base substrate to close openings of the dummy grooves.
|
