发明名称 SEMICONDUCTOR DEVICE HAVING STRAIN MATERIAL
摘要 A semiconductor device having strain material is disclosed in a particular embodiment, the semiconductor device includes a first cell including a first gate between a first drain and a first source. The semiconductor device also includes a second cell adjacent to the first cell. The second cell includes a second gate between a second drain and a second source. The semiconductor device further includes a shallow trench isolation area between the first source and the second source. A first amount of strain material over the first source and over the second source is greater than a second amount of strain material over the first drain and over the second drain.
申请公布号 KR20120095433(A) 申请公布日期 2012.08.28
申请号 KR20127015744 申请日期 2010.11.19
申请人 QUALCOMM INCORPORATED 发明人 YANG HAINING
分类号 H01L21/8246;H01L27/112 主分类号 H01L21/8246
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