发明名称 |
Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof |
摘要 |
An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
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申请公布号 |
US8253225(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20080035598 |
申请日期 |
2008.02.22 |
申请人 |
OTREMBA RALF;SEIBT MARCO;KIRCHNER UWE;PEINHOPF WOLFGANG;TREU MICHAEL;SCHLOEGL ANDREAS;FELDVOSS MARIO;INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF;SEIBT MARCO;KIRCHNER UWE;PEINHOPF WOLFGANG;TREU MICHAEL;SCHLOEGL ANDREAS;FELDVOSS MARIO |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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