| 摘要 |
A method of forming solder bumps on a substrate is disclosed. The method includes forming a plurality of contact points on the substrate. The method further includes depositing a layer of surface finish material on the plurality of contact points. Furthermore, the method includes disposing a plurality of solder balls on the layer of surface finish material. Each solder ball of the plurality of solder balls has conductive material including a solder alloy and Phosphorus. Thereafter, the method includes applying a solder reflow process to the plurality of solder balls to configure a plurality of solder bumps on the substrate layer. The concentration of the Phosphorus in the solder material is based on target performance characteristic of the substrate having the plurality of solder bumps. |
