发明名称 Positive photosensitive composition and method of forming resist pattern
摘要 A positive photosensitive composition comprises: (A) 5 to 20 parts by weight of the total amount of at least one compound that generates an acid upon irradiation with an actinic ray; and (B) 100 parts by weight of the total amount of at least one fluorine atom-containing resin having a group that increases a solubility of the resin in an alkaline developer by the action of an acid.
申请公布号 US8252508(B2) 申请公布日期 2012.08.28
申请号 US20100819490 申请日期 2010.06.21
申请人 KODAMA KUNIHIKO;FUJIFILM CORPORATION 发明人 KODAMA KUNIHIKO
分类号 G03F7/004;G03F7/039;G03F7/20 主分类号 G03F7/004
代理机构 代理人
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