发明名称 |
Semiconductor package and stacked layer type semiconductor package |
摘要 |
In a stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, the plurality of packages include a semiconductor package including: a semiconductor chip; a substrate in which a concave portion has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
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申请公布号 |
US8253229(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20070976249 |
申请日期 |
2007.10.23 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU;KOBAYASHI TSUYOSHI |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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