发明名称 |
Heat-transfer mechanism and information device |
摘要 |
A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing. |
申请公布号 |
US8254128(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20100760849 |
申请日期 |
2010.04.15 |
申请人 |
YASUI MAIKO;RICOH COMPANY, LTD. |
发明人 |
YASUI MAIKO |
分类号 |
H05K7/20;F28F7/00;H01L23/34;H01L23/495;H05K7/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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