发明名称 Heat-transfer mechanism and information device
摘要 A heat-transfer mechanism which transfers heat of a heat-generating component mounted on a board to a housing includes a heat-transfer plate having a bottom face portion which has contact with the heat-generating component, a first heat-transfer portion which is screwed near one end portion of the housing and a second heat-transfer portion which is screwed near the other end portion of the housing.
申请公布号 US8254128(B2) 申请公布日期 2012.08.28
申请号 US20100760849 申请日期 2010.04.15
申请人 YASUI MAIKO;RICOH COMPANY, LTD. 发明人 YASUI MAIKO
分类号 H05K7/20;F28F7/00;H01L23/34;H01L23/495;H05K7/00 主分类号 H05K7/20
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