发明名称 |
Method for forming under a thin layer of a first material portions of another material and/or empty areas |
摘要 |
A method for forming an empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer. |
申请公布号 |
US8252638(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20070712353 |
申请日期 |
2007.02.28 |
申请人 |
CORONEL PHILIPPE;LAPLANCHE YVES;PAIN LAURENT;STMICROELECTRONICS S.A. |
发明人 |
CORONEL PHILIPPE;LAPLANCHE YVES;PAIN LAURENT |
分类号 |
G03F7/11;H01L21/84;G03F7/20;G03F7/36;G03F7/40;H01L21/027;H01L21/3205;H01L21/336;H01L21/768;H01L27/12;H01L29/423;H01L29/786 |
主分类号 |
G03F7/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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