发明名称 |
Sub-micron decal transfer lithography |
摘要 |
The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate. |
申请公布号 |
US8252191(B2) |
申请公布日期 |
2012.08.28 |
申请号 |
US20060911787 |
申请日期 |
2006.05.05 |
申请人 |
HEEJOON AHN;NUZZO RALPH;SHIM ANNE;DOW CORNING CORPORATION |
发明人 |
HEEJOON AHN;NUZZO RALPH;SHIM ANNE |
分类号 |
B44C1/22 |
主分类号 |
B44C1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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