发明名称 Photoelectric conversion device fabrication method
摘要 Provided is a photoelectric conversion device fabrication method that realizes both high productivity and high conversion efficiency by rapidly forming an n-layer having good coverage. The fabrication method for a photoelectric conversion device includes a step of forming a silicon photoelectric conversion layer on a substrate by a plasma CVD method. In the fabrication method for the photoelectric conversion device, the step of forming the photoelectric conversion layer includes a step of forming an i-layer formed of crystalline silicon and a step of forming, on the i-layer, an n-layer under a condition with a hydrogen dilution ratio of 0 to 10, inclusive.
申请公布号 US8252668(B2) 申请公布日期 2012.08.28
申请号 US200913003936 申请日期 2009.08.18
申请人 YAMAGUCHI KENGO;SAKAI SATOSHI;TAKEUCHI YOSHIAKI;MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 YAMAGUCHI KENGO;SAKAI SATOSHI;TAKEUCHI YOSHIAKI
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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