发明名称 |
ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR BONDING, METHOD FOR MOUNTING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE |
摘要 |
The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler. |
申请公布号 |
KR20120095353(A) |
申请公布日期 |
2012.08.28 |
申请号 |
KR20127007459 |
申请日期 |
2010.03.18 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
LEE, YANG SOO;WAKIOKA SAYAKA;NAKAYAMA ATSUSHI;DILAO CARL ALVIN |
分类号 |
H01L21/60;C09J7/00;C09J163/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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