HEAT SINK FOR ELECTRONIC DEVICE, AND PROCESS FOR PRODUCTION THEREOF

摘要

The present invention provides a heat sink for an electronic device having low heat expansion properties, excellent heat conductivity particularly in the direction of thickness, and a reduced entire thickness produced by joining a Cr-Cu alloy sheet comprising a Cu matrix and more than 30 mass% and not more than 80 mass% of Cr to a Cu sheet and rolling the joined product, thereby producing a laminate having a Cr-Cu alloy layer and a Cu layer.