PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT

摘要

PURPOSE: A piezoelectric device and a manufacturing method thereof are provided to improve an electric property by sealing the piezoelectric device with thermosetting adhesive films. CONSTITUTION: A piezoelectric device chip(130) has a pump and an electrode mounted on a package substrate. A sealing member(140) is arranged on the package substrate mounting a piezoelectric device chip. A thermosetting adhesive film(150) is formed on the sealing member and adheres the sealing member with the package substrate. A zig pressurizes the sealing member to the package substrate.