发明名称 Semiconductor device and fabrication method
摘要 A semiconductor device in one embodiment has a first connection region, a second connection region and a semiconductor volume arranged between the first and second connection regions. Provision is made, within the semiconductor volume, in the vicinity of the second connection region, of a field stop zone for spatially delimiting a space charge zone that can be formed in the semiconductor volume, and of an anode region adjoining the first connection region. The dopant concentration profile within the semiconductor volume is configured such that the integral of the ionized dopant charge over the semiconductor volume, proceeding from an interface of the anode region which faces the second connection region, in the direction of the second connection region, reaches a quantity of charge corresponding to the breakdown charge of the semiconductor device only near the interface of the field stop zone which faces the second connection region.
申请公布号 US8252671(B2) 申请公布日期 2012.08.28
申请号 US201113186470 申请日期 2011.07.20
申请人 MAUDER ANTON;SCHULZE HANS-JOACHIM;HILLE FRANK;SCHULZE HOLGER;PFAFFENLEHNER MANFRED;SCHAEFFER CARSTEN;NIEDERNOSTHEIDE FRANZ-JOSEF;INFINEON TECHNOLOGIES AUSTRIA AG 发明人 MAUDER ANTON;SCHULZE HANS-JOACHIM;HILLE FRANK;SCHULZE HOLGER;PFAFFENLEHNER MANFRED;SCHAEFFER CARSTEN;NIEDERNOSTHEIDE FRANZ-JOSEF
分类号 H01L21/425 主分类号 H01L21/425
代理机构 代理人
主权项
地址