SEMICONDUCTOR APPARATUS, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD

摘要

PURPOSE: A semiconductor device, a manufacturing method thereof, and a manufacturing method apparatus are provided to reduce the size of the semiconductor device by reducing the size of an imaging chip. CONSTITUTION: A first connection terminal is arranged on a first planar member which has a light receiving surface(101a) of an imaging device. A second planar member has a second connection terminal connected to the first connection member. A conductive bonding unit(161) is made of conductive materials and is bonded to the first connection terminal. A bonding wire connects the conductive bonding unit to the second connection terminal and is arranged along the plane of the first planar member to prevent reflected light from the bonding wire from being inputted to the light receiving surface.