| 摘要 |
PURPOSE: An apparatus and method for removing at least one chip type semiconductor component from a film are provided to prevent a semiconductor component from being damaged when the semiconductor component is removed from the film. CONSTITUTION: A semiconductor component is arranged on a first main surface(120) of an adhesive film. A lifting device(22) is arranged on a second main surface(122) of the adhesive film and a contact region(30) engaged with the adhesive film. The contact region includes a plurality of suction cutout units(50,52) and cutout units(42). All suction cutout units are connected to a vacuum control device or two suction cutout units or the suction cutout units of several groups are connected to an individual vacuum control device. |
