发明名称 USING HARSH CONDITIONS PACKAGE TESTING DEVICE
摘要 PURPOSE: A package test apparatus using a harsh condition is provided to obtain a stable package by adding the harsh condition to a package mounted in all kinds of cards installed in a computer under the real use environment. CONSTITUTION: A base board(P) forms a floor surface. An electronics resistance connection unit(100) is installed on the base board. The electronics resistance connection unit is connected to both end portions of a resistance terminal with the medium of a wire. The resistance terminal controls a power source of an expansion card. A controller(110) is installed in the base board and controls a resistance value inputted in the expansion card. An amplification unit(150) amplifies an electric signal outputted from the expansion card and transmits it to the controller. A display unit(120) indicates the electric signal transmitted to the controller.
申请公布号 KR101177051(B1) 申请公布日期 2012.08.27
申请号 KR20110061909 申请日期 2011.06.24
申请人 SOLID MECA CO., LTD. 发明人 LEE, IN CHEOL
分类号 G01R31/28 主分类号 G01R31/28
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