METHOD OF MANUFACTURING SUBSTRATE

摘要

PURPOSE: A method for manufacturing a substrate is provided to accurately process a surface roughness and a thickness of a wafer by maintaining an amount of abrasives and a particle size of the abrasives. CONSTITUTION: An ingot is cut with a wafer shape(S110). Both sides of the substrate cut with the wafer shape are lapped(S120). A sand blasting is performed by spraying abrasives on one surface of the substrate cut with the wafer shape(S130). The sand-blasted substrate is thermally processed(S140). The front surface of the thermally processed substrate is polished(S162).