| 摘要 |
PURPOSE: A work separating device and a work separating method are provided to prevent the deterioration of quality by selectively heating a sag part of a die attach film. CONSTITUTION: A work includes a semiconductor wafer with a preset separation line. A cooling chuck table(10) selectively cools an area of a die attach film including the preset separation line of the work. A lifting ring(12) separates the work from the die attach film by expanding a dicing tape(S). An optical heating device(22) selectively heats an area except the work of the dicing tape.
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