发明名称 |
ENCAPSULATED DIE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF MANUFACTURING SAID MICROELECTRONIC PACKAGE |
摘要 |
<p>An encapsulated die (100, 401) comprises a substrate (110, 510) having a first surface (111), an opposing second surface (112), and intervening side surfaces (113), with active devices located at the first surface of the substrate. The active devices are connected by a plurality of electrically conductive layers (120, 520) that are separated from each other by a plurality of electrically insulating layers (125, 525). A protective cap (130, 530) is located over the first surface of the substrate contains an interconnect structure (140) exposed at a surface (131) thereof. In another embodiment, a microelectronic package (200) comprises a package substrate (250) with an encapsulated die (100) such as was described above embedded therein.</p> |
申请公布号 |
WO2012061091(A3) |
申请公布日期 |
2012.08.23 |
申请号 |
WO2011US57594 |
申请日期 |
2011.10.25 |
申请人 |
INTEL CORPORATION;GUZEK, JOHN S.;SANKMAN, ROBERT L.;ICHIKAWA, KINYA;TOMITA, YOSHIHIRO;KUBOTA, JIRO |
发明人 |
GUZEK, JOHN S.;SANKMAN, ROBERT L.;ICHIKAWA, KINYA;TOMITA, YOSHIHIRO;KUBOTA, JIRO |
分类号 |
H01L23/28;H01L21/56;H01L23/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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