SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to reduce manufacturing costs by omitting rewinding process and a bump forming process for electrically interlinking a top semiconductor chip and a bottom semiconductor chip. CONSTITUTION: A first core layer(100a) comprises a one side(a) and the other side(b) facing the one side. A first semiconductor chip(104a) is attached on the one side of the first core layer by the medium of a first adhesive(102a). A first copper foil layer(110) is formed on the upper side of a first copper foil attachment resin(108a) in order to be electrically connected to a first bump. A second copper foil layer(111) is formed on the first copper foil layer. A copper foil attachment resin(108b) is formed on the second copper foil layer.