WAFER POLISHING APPARATUS

摘要

PURPOSE: A wafer polishing apparatus is provided to securely fix template assembly to a rubber chuck or a head body using a bond reinforcing member. CONSTITUTION: A rubber chuck(300) is combined with a head body(100). The rubber chuck comprises a membrane(310) and a rubber guide ring(320). Template assembly(400) comprises a guide member(420) and a template(410). The template is arranged under the membrane. The guide member is attached to the template. A bond reinforcing member(200) supports the template assembly. The bond reinforcing member is fixed to the rubber chuck or the head body by a bolt. A coupling groove for passing through the bolt is formed on the bond reinforcing member.