| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which has good electric characteristics and adhesion in a resin layer of a wiring board formed therefrom, and a laminate having a good processability, a wiring board having a good electric characteristics, and a manufacturing method of the wiring board. <P>SOLUTION: A resin composition is used to form an insulator layer of a wiring board. The resin composition comprises: a cyclic olefin-based resin, and a compound having an active ester group. The resin composition further comprises an epoxy resin and a filler. The cyclic olefin-based resin includes a norbornene-based resin. The laminate is used for a wiring board, and includes a resin layer formed from the resin composition, and stacked carrier films. A wiring board manufacturing method comprises steps of: forming the insulator layer with the resin composition; forming a circuit layer; and irradiating the insulator layer with laser thereby making an opening. <P>COPYRIGHT: (C)2012,JPO&INPIT |
