发明名称 EPOXY RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To improve dielectric characteristics and to maintain other characteristics. <P>SOLUTION: When an epoxy resin composition is cured on an aluminum foil by heating at 200&deg;C for 2 hours, the epoxy resin composition forms an ether bond, and the cured body satisfies the following (i) to (iii). (i) The dielectric constant (&epsi;) at 1 GHz is &ge;2.0 and &le;3.5. (ii) The dielectric loss tangent (tan&delta;) at 1 GHz is &ge;0.002 and &le;0.02. (iii) In the analysis by the infrared absorption method at 25&deg;C, where a peak indicating the stretching vibration of a carbon-carbon double bond is taken as a reference peak; the ratio of a peak intensity indicating the stretching movement of the ether bond to the reference peak is taken as I<SB POS="POST">1</SB>; and the ratio of a peak intensity indicating the stretching movement of the epoxy group to the reference peak is taken as I<SB POS="POST">2</SB>, I<SB POS="POST">1</SB>/I<SB POS="POST">2</SB>is &ge;2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012158681(A) 申请公布日期 2012.08.23
申请号 JP20110018912 申请日期 2011.01.31
申请人 SUMITOMO BAKELITE CO LTD 发明人 SHIRATO HIROTSUGU;TOBISAWA AKIHIKO
分类号 C08G59/68;B32B5/28;B32B15/08;B32B17/04;B32B27/38;C08J5/24;H01L23/14;H05K1/03 主分类号 C08G59/68
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