| 摘要 |
A semiconductor substrate comprising a first surface and a second surface, a first electrode, and a second electrode are arranged. The first electrode comprises a plurality of main electrodes located on the first surface and a plurality of first output taking parts electrically connected to the plurality of main electrodes and located on the second surface. The second electrode comprises one pair of collection parts located on the second surface to sandwich the first output taking parts and a connection part that electrically connects the one pair of collection parts to each other. The plurality of main electrodes comprise a first group located at first intervals and a second group located at second intervals. Third intervals between the first group and the second group are larger than the first and second intervals, and the connection part is located at positions corresponding to the third interval on the second surface. |
