| 摘要 |
PURPOSE: A semiconductor package is provided to easily execute an underfill process by inserting a bottom element having a first size within a groove and laminating a top element having a second size on a substrate. CONSTITUTION: A body(100) comprises a one surface(a) and the other surface(b) facing the one surface. A groove and a voland(101) are respectively formed on the one surface and the other surface of the body. An external connection terminal such as a solder ball is attached to the voland. A first connection unit(102a) and a second connection unit(102b) are formed inside the body. A bottom element(A) is arranged within the groove of the body. A top element(B) is arranged on the body which includes the bottom element. |
