| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin, high density wiring board having a wiring conductor width of 30 μm and a wiring conductor interval of about 40 μm. <P>SOLUTION: Copper foil 6 is attached to both surfaces of an insulating layer 1 to prepare the insulating layer 1 with the copper foil 6. A through hole 3 is formed through the insulating layer 1 with the copper foil 6. A plating metal layer 4 for forming a through conductor 5 filling the through hole 3 and lands 7 connecting to the through conductor 5 is selectively deposited in the through hole 3 and vicinities thereof to a thickness completely filling the through hole 3. The copper foil 6 exposed outside the plating metal layer 4 is selectively etched in a predetermined pattern to leave, in the through hole 3, the through conductor 5 comprising the plating metal layer 4 and, on both surfaces of the insulating layer 1, the lands 7 comprising the copper foil 6 and plating metal layer 4 and wiring conductors 8 comprising the copper foil 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
