| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a cooling mechanism which enables noise reduction and power saving of an electronic apparatus. <P>SOLUTION: In a cooling mechanism, components 11 to 13 including a high heat generating component 5, which compose an electronic apparatus, are mounted on a circuit board 9, and the circuit board 9 is fixed at a substantially central part of a case in the height direction by using a substrate fixing component 10. Passages 14, 15 are respectively formed on the component mounting surface of the circuit board 9 and the opposite side of the component mounting surface of the circuit board for flowing cooling air generated by cooling fans. The cooling mechanism further includes: a heat receiving part 6 contacting with the high heat generating component 5, heat transfer parts 7 connecting with the heat receiving part 6 and transferring heat to the opposite side of the component mounting surface of the circuit board, and a heat radiation part 8 connecting with the heat transfer part 7 and provided in the passage 15 on the opposite side of the component mounting surface of the circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
