发明名称 |
Package Substrate and Method for Forming the Same |
摘要 |
A package substrate is disclosed. The package substrate includes a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions. A method for forming the package substrate is also disclosed.
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申请公布号 |
US2012211792(A1) |
申请公布日期 |
2012.08.23 |
申请号 |
US201113111009 |
申请日期 |
2011.05.19 |
申请人 |
WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG;VIKING TECH CORPORATION |
发明人 |
WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG |
分类号 |
H01L33/62;H01L21/28 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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