| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing efficiency, in an electronic circuit device of a structure in which a heat generating electronic device generating heat by energization and a circuit substrate electrically connected to that are fixed on a mounting surface of a heat radiating member. <P>SOLUTION: An electronic circuit device 1 comprises a heat radiating member 3; a heat generating electronic device 2 equipped with a device body 21 placed on a mounting surface 31a, and an external terminal 22 projecting out from the device body 21 to an upper side of the mounting surface 31a; a circuit substrate 4 fixed to the heat radiating member 3 while keeping an interval above the device body 21 placed on the mounting surface 31a, and electrically connected to the heat generating electronic device 2 by coupling the external terminal 22; and an energizing member 5 fixed to the circuit substrate 4 at one end portion 51, and abutting on the device body 21 placed on the mounting surface 31a at the other end portion 52. While the circuit substrate 4 is fixed to the heat radiating member 3, the device body 21 is pressed against the mounting surface 31a by the energizing force of the energizing member 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
