| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming device which does not require heat resistance in a pressure gauge for measuring a pressure of a film-forming container and is capable of reducing an installation area. <P>SOLUTION: A film forming device for forming a film on a substrate retained in a film forming container 11 by supplying material gas to the substrate comprises: a supply mechanism which supplies the material gas to the film forming container 11; an exhaust mechanism 25 which exhausts the gas from the film forming container 11; a trap part 30 which is provided in the middle of an exhaust flow passage 55 in which the gas flows from the film forming container 11 to the exhaust mechanism 25 and captures the material gas by depositing a product containing the material gas; a purge gas supply part 50 which is connected so as to merge into the exhaust flow passage 55 between the film forming container 11 and the trap part 30 and supplies the purge gas to the exhaust flow passage 55; and a pressure guage 51 provided in the middle of a purge gas supply passage 52 in which the purge gas flows from the purge gas supply part 50 to the exhaust flow passage 55. <P>COPYRIGHT: (C)2012,JPO&INPIT |
