摘要 |
<p>In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.</p> |
申请人 |
KIONIX, INC.;BLACKMER, CHARLES, W.;ADAMS, SCOTT, G.;HOCKING, ANDREW, S.;LYNCH, KRISTIN, J.;SHAH, ASHISH, A. |
发明人 |
BLACKMER, CHARLES, W.;ADAMS, SCOTT, G.;HOCKING, ANDREW, S.;LYNCH, KRISTIN, J.;SHAH, ASHISH, A. |