发明名称 POLISHING APPARATUS
摘要 <p>Provided is a polishing apparatus capable of maintaining polishing precision although fewer expendable parts are periodically replaced. The polishing apparatus comprises: a polishing lap (20) having a polishing surface (20a) on the front side thereof to polish an end surface of a workpiece; a support mechanism (30) for supporting a rear surface (20b) of the polishing lap (20) while allowing movement of the polishing lap (20) on a predetermined plane; a workpiece holder (50) for holding the workpiece in a manner such that the end surface of the workpiece makes contact with the polishing surface of the polishing lap (20); and a driving mechanism (70) for linearly reciprocating the polishing lap (20) while rotating the polishing lap (20).</p>
申请公布号 WO2012111290(A1) 申请公布日期 2012.08.23
申请号 WO2012JP00891 申请日期 2012.02.09
申请人 NTT ADVANCED TECHNOLOGY CORPORATION;TEITSU ENGINEERING CO., LTD;ANDOU, KAZUTOSHI;KIMURA, TOSHINORI;MIZUNO, SADAAKI 发明人 ANDOU, KAZUTOSHI;KIMURA, TOSHINORI;MIZUNO, SADAAKI
分类号 B24B19/00;B24B41/06 主分类号 B24B19/00
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