发明名称 DOUBLE-LAYER INJECTION MOULDED CASING, METHOD FOR PREPARATION THEREOF, AND ELECTRICAL APPARATUS
摘要 <p>Provided are a double-layer injection moulded casing, a method for the preparation thereof, and an electrical apparatus, which can belong to the technical field of injection moulding and solve the problems of process complexity and low production efficiency of existing preparation processes for double-layer injection moulded casings. A double-layer injection moulded casing comprises an outer layer (1) and an inner layer (2) connected to each other, and a locating structure (3) integrally formed with the inner layer (2) is located on the inner side of the inner layer (2). A method for preparing the above double-layer injection moulded casing comprises: using a multiple-pass injection moulding process for the preparation, in which the locating structure (3) of the double-layer injection moulded casing is integrally formed with the inner layer (2) in one and the same injection moulding pass. The above electrical apparatus comprises the above double-layer injection moulded casing. The above double-layer injection moulded casing can be used as the housing of the electrical apparatus.</p>
申请公布号 WO2012109943(A1) 申请公布日期 2012.08.23
申请号 WO2011CN84535 申请日期 2011.12.23
申请人 HISENSE HIVIEW TECH CO., LTD;WANG, DEJUN;ZHANG, WANGJUN;JIANG, HAODE 发明人 WANG, DEJUN;ZHANG, WANGJUN;JIANG, HAODE
分类号 B29C45/16;B29C45/14;H04N5/64;H05K5/00 主分类号 B29C45/16
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