ALUMINUM-DIAMOND COMPOSITE, AND METHOD FOR PRODUCTION THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an aluminum-diamond composite which has high heat conductivity and thermal expansion coefficient close to that of a semiconductor device in combination, and whose surface roughness is improved so as to be suitable for being used as the heatsink of the semiconductor device or the like.

SOLUTION: The tabular aluminum-diamond composite 1 comprising diamond particles and a metal including aluminum as a main component comprises a complexed part 2 and the surface layers 3 provided on both faces of the complexed part. The surface layer 3 comprises a diamond-like carbon material having thickness of 0.3-50 μm, and the content of the diamond particles is 40-70 vol.% of the whole aluminum-diamond composite.

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