| 摘要 |
Methods herein provide for estimating a high frequency performance of a PCB via model through simulation. A via model is generated to include a representation of structures of a via, such as input and output pads, and input and output stubs. A signal path in the model is defined from an input pad of the model to an output pad of the model along a transmission line segment between the input pad and the output pad. Frequency dependent input impedance values at the input pad are generated based on one or more of the input pad diameter value, the output pad diameter value, the input stub length value, and the output sub length value. A high frequency performance of the via model is estimated based on the frequency dependent input impedance values at the input pad.
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