STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A stacked package and a manufacturing method thereof are provided to prevent a phenomenon that neighboring plugs are shorted by forming a gap between a first semiconductor package and a second semiconductor package through a spacer. CONSTITUTION: A first package substrate(110) comprises an insulating substrate and a circuit pattern. A first semiconductor chip(120) is located at the center of the top of the first package substrate. A conductive bump(130) is placed between the first semiconductor chip and the first package substrate and electrically interlinks pads of the first semiconductor chip and the circuit of the first package substrate. A first molding member(140) covers the upper surface of the first semiconductor chip. A spacer(144) is formed at the upper surface of the first molding member.