| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition that shows excellent insulation reliability and flowability, exhibits excellent flame retardance in a non-halogen system, and is useful for a semiconductor sealing material, a molding material, a laminating material, a powder coating, an adhesive material and the like. <P>SOLUTION: The epoxy resin composition contains an epoxy resin, a phenolic curing agent, an inorganic filler, and a metallic hydroxide flame retardant. An epoxy resin, obtained by introducing a glycidyl group into a multivalent hydroxy compound obtained by adding stylenes to a condensation product of formaldehyde and phenols, is used as an epoxy resin component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
