发明名称 MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS
摘要 Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
申请公布号 WO2012112618(A1) 申请公布日期 2012.08.23
申请号 WO2012US25132 申请日期 2012.02.14
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA;CHANG, MAU-CHUNG;TAM, SAI-WANG;BYUN, GYUNG-SU;KIM, YANGHYO;THERDSTEERASUKDI, KANIT;IR, JEREMY;REINMAN, GLENN;CONG, JINGSHENG 发明人 CHANG, MAU-CHUNG;TAM, SAI-WANG;BYUN, GYUNG-SU;KIM, YANGHYO;THERDSTEERASUKDI, KANIT;IR, JEREMY;REINMAN, GLENN;CONG, JINGSHENG
分类号 G11C7/10;G06F13/14;G11C7/22;G11C11/4096 主分类号 G11C7/10
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