| 摘要 |
The present invention relates to a method for fabricating an organic device, said method comprising: (i) Providing a substrate (1) having a surface comprising electrical contact structures (4) and a dielectric portion (3), (ii) Providing a first temporary protection layer (9) on some or all of said electrical contact structures (4), (iii) Providing a first surface modification layer (6) on the dielectric portion (3) and/or providing a third surface modification layer (10) on said electrical contact structures (4) not protected in step (ii), (iv) Removing the first temporary protection layer (9), (v) Providing a second surface modification layer (5) on the electrical contact structures that where protected in step (ii), and (vi) Providing said first surface modification layer (6) on the dielectric portion (3), if it was not provided in step (iii), and (vii) Providing an organic semiconductor layer (7) on top of at least part of said first surface modification layer (6) and on top of said second (5) surface modification layer and if present on top of said third surface modification layer (10), thereby obtaining said organic device or providing an organic semiconductor layer of a first type (7) on top of said second surface modification layer (5) and part of said first surface modification layer (6) and providing an organic semiconductor layer of a second type (8) on top of said third surface modification layer and another part of said first surface modification layer (6), thereby obtaining said organic device. |
