Cooling arrangement for computer i.e. tower computer, has heat sink provided on component of motherboard and arranged such that active air-stream flows through heat sink in one direction and free convection air-stream in another direction
摘要
<p>The arrangement has a heat sink (1) provided on a heat-generating component of a motherboard. A computer comprises a housing with the motherboard, and a fan (5) produces an active air-stream (A). The heat sink is formed and arranged such that the active air-stream flows through the heat sink in one direction and a free convection air-stream (B) in another direction. The housing comprises a platform and mutually parallel heat sink fins (3), which are oriented perpendicular to the platform and in alignment with the active air flow. The heat sink fins are aligned parallel to the motherboard. An independent claim is also included for a method for cooling a computer.</p>
