APPARATUS AND METHOD FOR CENTERING WAFER

摘要

PURPOSE: A wafer centering apparatus and a wafer centering method are provided to accurately center a wafer by controlling pressure of sprayed air. CONSTITUTION: A pad(100) is arranged in the center of a wafer. An outer spray unit(200) sprays compressed air to an edge portion of the wafer. The outer spray unit comprises a plurality of spray holes(210). The plurality of spray holes is separated at regular intervals. A central spray unit(300) sprays the compressed air toward the bottom of the wafer. The air spray pressure of the outer spray unit is stronger than the air spray pressure of the central spray unit. The air spray pressure of the outer spray unit is 20kPa to 30kPa. The air spray pressure of the central spray unit is 5kPA to 10kPa.