| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lamination type electronic component with a large inductance while miniaturizing the electronic component. <P>SOLUTION: A lamination type electronic component 1 comprises a first insulator layer 3 having a first wiring formation region 3a opened on upper and lower faces; a first coil wiring conductor 5 arranged in the first wiring formation region 3a and parallel wound on the upper face of the first insulator layer 3; a second insulator layer 7 laminated on the upper face of the first insulator layer 3 and having a second wiring formation region 7a opened to upper and lower faces; and a second coil wiring conductor 9, which is arranged in the second wiring formation region 7a, and parallel wound on the upper face of the second insulator layer 7, and whose one end is connected with one end of the first coil wiring conductor 5. When the first coil wiring conductor 5 and the second coil wiring conductor 9 are seen in a flat perspective plane, the second coil wiring conductor 9 is positioned to surround the first coil wiring conductor 5. <P>COPYRIGHT: (C)2012,JPO&INPIT |
